Packaging & Memory

Chiplets, 3D IC, HBM stacks, DDR5/PCIe lanes, and bandwidth tradeoffs.

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ServeTheHome
servethehome.com > d-matrix-joins-the-nvidia-nvlink-fusion-platform

d-Matrix Joins the NVIDIA NVLink Fusion Platform

7+ hour ago   (203+ words) This week, d-Matrix and NVIDIA had a big announcement. The companies announced that d-Matrix would bring its next-generation XPUs to the NVLink Fusion platform. A closer look at the announcement revealed a few interesting details. We covered the d-Matrix Raptor…...

Interesting Engineering
interestingengineering.com > ai-robotics > top-5-chipmakers-battling-to-control-computing

5 companies building high-performance compute silicon

15+ hour, 21+ min ago   (575+ words) These companies are building the processors behind advanced AI models. The artificial intelligence boom is creating an almost insatiable demand for computing power. Behind every chatbot, image generator and reasoning model are specialized chips performing vast numbers of calculations within…...

Techmeme
techmeme.com > 260912 > p4

South Korea's espionage laws, broadened for the first time in over seven decades, take effect on Sept. 13 as foreign spies increasingly target its chip sector

18+ hour, 12+ min ago   (12+ words) Top news and commentary for technology's leaders, from all around the web....

DEV Community
dev.to > khasky > edge0-streams-moe-experts-off-ssd-to-fit-35b-in-3-gb-3308

Edge0 streams MoE experts off SSD to fit 35B in 3 GB

23+ hour, 14+ min ago   (108+ words) Where does a 35B model go when it only takes 2.9 GB of RAM? I went into Edge0 to find out, and I... Tagged with llm, machinelearning, opensource, apple....

Medium
medium.com > the-geopolitical-economist > the-chip-war-is-not-the-story-anymore-8f165d95fa2a

The Chip War Is Not the Story Anymore

21+ hour, 40+ min ago   (31+ words) Technology, Geopolitics, Artificial Intelligence The Chip War Is Not the Story Anymore What this week’s news on the Xi-Trump summit, export controls, and AI clubs actually changed If you’re not a …...

BIOENGINEER.ORG
bioengineer.org > interfacial-and-mechanical-engineering-for-scalable-3d-integration-of-robust-stretchable-electronics

Interfacial and mechanical engineering for scalable 3D integration of

1+ day, 7+ min ago   (762+ words) The pursuit of scalable three-dimensional integration represents one of the most consequential engineering challenges facing the flexible and stretchable electronics community. Conventional rigid electronics benefited for decades from a mature manufacturing ecosystem in which planar fabrication, interconnect routing, packaging, and…...

design-reuse.com
design-reuse.com-reuse.com

Advanced AI Scaling with 3D-IC and Heterogeneous Integration

6+ day, 11+ hour ago   (386+ words) Addressing these challenges requires more than conventional multi-die integration. It calls for a system-level, signoff-ready approach that can manage full-stack interactions, unify power and multiphysics analysis, and scale efficiently enough to keep advanced AI and HPC programs on track. This…...

Antara News
en.antaranews.com > news > 425663 > kioxia-showcases-flash-storage-innovations-for-the-ai-era-at-fms-2026

Kioxia Showcases Flash Storage Innovations for the AI Era at FMS 2026

1+ mon, 1+ week ago   (166+ words) -Kioxia group, a world leader in memory solutions, will demonstrate how its flash memory and SSD technologies, including the KIOXIA GP1 Series PCIe® 6.0... Kioxia Showcases Flash Storage Innovations for the AI Era at FMS 2026 - KIOXIA GP1 Series Super High IOPS SSDs — 10 million…...

@phoronix
phoronix.com > news > Intel-Thermald-2.5.13

Intel Thermald 2.5.13 Restores Accidentally Deleted Wildcat Lake Support

1+ day, 18+ hour ago   (222+ words) Intel's Thermald released on Thursday as the newest update to this daemon for thermal monitoring on Intel hardware that was also recently extended for beginning to support Qualcomm/ARM hardware too. The main change with Thermald 2.5.13 is adding back Intel…...

DIGITIMES
digitimes.com > news > a20/26/0910VL220 > sk-hynix-high-na-dram-2028-samsung.html

Samsung, SK Hynix eye 2028 High-NA DRAM rollout

2+ day, 6+ hour ago   (106+ words) digitimes Samsung, SK Hynix eye 2028 High-NA DRAM rollout ASML's TWINSCAN EXE:5200B High-NA EUV lithography system. Credit: ASML Keep me signed in - Track financials & stock data of Taiwan tech. - Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace,…...