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EE Times
eetimes.com > nvidia-acquires-huggingface-for-12-9b

Nvidia Acquires HuggingFace for $12.9B

5+ day, 22+ hour ago   (507+ words) Nvidia has acquired HuggingFace for $12.9 billion. The startup, which is named after an emoji, was founded by three French entrepreneurs in 2016. It has become the go-to repository for open-source AI models, datasets, and associated software libraries. In a press…...

EE Times
eetimes.com > product-configuration-guide-for-electronics-manufacturers

Product Configuration Guide for Electronics Manufacturers

1+ week, 5+ day ago   (1523+ words) Product configuration makes it possible for electronics manufacturers to offer different product variants without engineering every order from scratch. By defining options and compatibility rules in advance, manufacturers can give customers more choice while keeping BOMs, assembly processes, purchasing, testing,…...

EE Times
eetimes.com > mercedes-spinout-athos-closes-its-doors

Mercedes Spinout Athos Closes Its Doors

1+ week, 3+ day ago   (178+ words) Automotive functional safety chiplet startup Athos Silicon has closed its doors. Former Athos CEO Charnjiv Bangar told EE Times that Athos has ceased operations after its board made the decision to wind down and dissolve the company. Athos originally developed…...

Google News
eetimes.com > indian-startup-hrdwyr-builds-ai-native-socs-for-the-physical-world

Indian Startup HrdWyr Builds AI-Native SoCs for the Physical World

1+ week, 4+ day ago   (1263+ words) The demand for local AI inference is changing the requirements of AI-enabled SoCs. Indian startup HrdWyr is building its SoCs around the interaction of AI, real-time control, signal processing, and data movement. The Bengaluru-based fabless semiconductor company, founded by Ramamurthy…...

EE Times
eetimes.com > inside-rochester-electronics-tls360-program

Inside Rochester Electronics??? TLS360??? Program

1+ week, 5+ day ago   (252+ words) Standard semiconductor lifecycles are built around the original manufacturer’s roadmap. Once a part reaches end-of-life milestones, it typically transitions to “Not Recommended for New Designs” (NRND), then to formal discontinuation—regardless of how long the systems that rely…...

EE Times
eetimes.com > ic-components-a-professional-sourcing-platform-with-over-20-years-of-experience

IC Components Sourcing Platform: Over 20 Years of Experience

1+ week, 5+ day ago   (248+ words) For IC Components, industry experience is not simply about being able to locate more products. It is also about understanding more accurately what customers actually need and which factors may affect the final sourcing decision. For memory products, IC Components…...

EE Times
eetimes.com > sk-hynixs-4b-hbm-project-targets-u-s-chipmaking-gap

SK Hynix???s $4B HBM Project Targets U.S. Chipmaking Gap

1+ week, 5+ day ago   (853+ words) SK Hynix’s first high-bandwidth memory (HBM) advanced packaging facility in the U.S., worth $4 billion, is aimed at helping to close a manufacturing vulnerability in the American semiconductor industry. South Korea’s memory giant said in an event in the…...

EE Times
eetimes.com > why-automation-is-essential-to-achieve-eu-cra-compliance

Why Automation Is Essential to Achieve EU CRA Compliance

2+ week, 4+ day ago   (164+ words) The European Commission describes the CRA as applying to hardware and software products with digital elements made available on the EU market. Once a product is in scope, the manufacturer must do much more than run a scanner or create…...

EE Times
eetimes.com > indias-osat-atmp-build-out-from-legacy-packages-to-2-5d

India???s OSAT-ATMP Build-Out: From Legacy Packages to 2.5D

2+ week, 4+ day ago   (1500+ words) The Andhra Pradesh state government has approved the ASIP project at ₹2,500 crore (~$300 million at the time of approval). In an exclusive conversation with EE Times, ASIP Technologies CEO Venkata Simhadri said the plant will begin with flip-chip ball-grid array…...

EE Times
eetimes.com > tsmcs-hbm-packaging-yield-issues-help-intel-analysts-say

TSMC???s HBM-Packaging Yield Issues Help Intel, Analysts Say

2+ week, 5+ day ago   (809+ words) TSMC’s difficulty stitching together AI accelerators with high-bandwidth memory (HBM) on a single chip gives Intel a chance to win foundry customers, according to Counterpoint Research co-founder Neil Shah and other analysts commenting to EE Times. TSMC’s CoWoS…...

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